Invention Grant
- Patent Title: Method and apparatus for filling a gap
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Application No.: US15222780Application Date: 2016-07-28
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Publication No.: US10395919B2Publication Date: 2019-08-27
- Inventor: Zaitsu Masaru , Atsuki Fukazawa
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: C23C16/02
- IPC: C23C16/02 ; C23C16/50 ; H01L21/02 ; C23C16/455 ; H01L21/762 ; C23C16/04 ; C23C16/30

Abstract:
According to the invention a method for filling one or more gaps created during manufacturing of a feature on a substrate is provided by providing the substrate in a reaction chamber and providing a deposition method. The deposition method comprises; providing an anisotropic plasma to bombard a bottom area of a surface of the one or more gaps with ions thereby creating adsorption sites at the bottom area; introducing a first reactant to the substrate; and, allowing the first reactant to react with the adsorption sites at the bottom area of the surface to fill the one or more gaps from the bottom area upwards.
Public/Granted literature
- US20180033616A1 METHOD AND APPARATUS FOR FILLING A GAP Public/Granted day:2018-02-01
Information query
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