Invention Grant
- Patent Title: Pixilated cooling, temperature controlled substrate support assembly
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Application No.: US14536803Application Date: 2014-11-10
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Publication No.: US10403534B2Publication Date: 2019-09-03
- Inventor: Vijay D. Parkhe , Wendell Boyd, Jr. , Matthew James Busche , Konstantin Makhratchev , Masanori Ono , Senh Thach
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; H01L21/683
Abstract:
Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.
Public/Granted literature
- US20150129165A1 PIXILATED COOLING, TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY Public/Granted day:2015-05-14
Information query
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