Invention Grant
- Patent Title: Methods of forming flipped RF filter components
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Application No.: US16133070Application Date: 2018-09-17
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Publication No.: US10535909B2Publication Date: 2020-01-14
- Inventor: Shaowu Huang , Belgacem Haba
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01P1/203 ; H05K1/16 ; H01P11/00 ; H05K1/02 ; H05K3/46

Abstract:
Methods of forming flipped radio frequency (RF) filter components are provided. An example method for miniaturizing conventional planar RF filters comprises: determining radio frequency (RF) filtering characteristics of a conventional planar microstrip RF filter or a conventional stripline RF filter, determining distributed RF filter elements for emulating the RF filtering characteristics of the conventional planar microstrip RF filter or the conventional stripline RF filter, creating each distributed RF filter element on a substrate, laminating a stack of the distributed RF filter elements into a single solid RF filter module; and mounting the single solid RF filter module on a horizontal substrate to vertically dispose the distributed RF filter elements of the stack. The methods create laminated stacks of distributed RF filter elements that provide a dramatic reduction in size over the horizontal planar RF filters that they replace. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries.
Public/Granted literature
- US20190036191A1 FLIPPED RF FILTERS AND COMPONENTS Public/Granted day:2019-01-31
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