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公开(公告)号：US20200227360A1
公开(公告)日：2020-07-16
申请号：US16833445
申请日：2020-03-27
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz
IPC: H01L23/552
Abstract: Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.
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公开(公告)号：US10149377B2
公开(公告)日：2018-12-04
申请号：US15192549
申请日：2016-06-24
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz , Belgacem Haba
IPC: H05K1/02 , H05K3/10 , H05K1/18 , H05K1/11 , H03H7/38 , H01P11/00 , H01L21/48 , H01P3/08 , H01L23/498 , H01L23/66 , H01P5/02 , H01P3/02 , H01P3/18
Abstract: A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.
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公开(公告)号：US20180102578A1
公开(公告)日：2018-04-12
申请号：US15287056
申请日：2016-10-06
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Belgacem Haba
CPC classification number: H01P1/203 , H01P1/20354 , H01P1/20363 , H01P1/20372 , H01P1/2039 , H01P11/007 , H05K1/0203 , H05K1/0233 , H05K1/16 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/4611
Abstract: Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA™) version can provide flipped RF and microwave filters.
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公开(公告)号：US20170374734A1
公开(公告)日：2017-12-28
申请号：US15192549
申请日：2016-06-24
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz , Belgacem Haba
IPC: H05K1/02 , H05K1/18 , H05K1/11 , H01L23/66 , H01P11/00 , H01L21/48 , H01P3/08 , H01L23/498 , H05K3/10 , H03H7/38
CPC classification number: H05K1/0228 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01P3/026 , H01P3/081 , H01P3/18 , H01P5/028 , H01P11/003 , H03H7/38 , H05K1/0245 , H05K1/0248 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K3/10
Abstract: A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.
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公开(公告)号：US20220278048A1
公开(公告)日：2022-09-01
申请号：US17749442
申请日：2022-05-20
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz
IPC: H01L23/538 , H01L21/48 , H01L23/498 , H01L23/00 , H01L25/065
Abstract: Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.
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Patent Agency Ranking
公开(公告)号：US20190341350A1
公开(公告)日：2019-11-07
申请号：US16515417
申请日：2019-07-18
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz
IPC: H01L23/538 , H01L25/065 , H01L23/498 , H01L23/00 , H01L21/48
Abstract: Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.
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公开(公告)号：US10403577B1
公开(公告)日：2019-09-03
申请号：US15970055
申请日：2018-05-03
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz
IPC: H01J1/62 , H01L23/538 , H01L23/498 , H01L23/00 , H01L21/48 , H01L25/065
Abstract: Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.
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公开(公告)号：US10109903B2
公开(公告)日：2018-10-23
申请号：US15287056
申请日：2016-10-06
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Belgacem Haba
Abstract: Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate are laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVATM) version provides flipped RF and microwave filters.
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公开(公告)号：US20180040587A1
公开(公告)日：2018-02-08
申请号：US15669269
申请日：2017-08-04
Applicant: Invensas Corporation
Inventor： Min Tao , Zhuowen Sun , Belgacem Haba , Hoki Kim , Wael Zohni , Shaowu Huang
IPC: H01L25/065 , H01L23/367 , H01L25/18 , H01L23/31 , H01L25/00 , H01L23/00
Abstract: Vertical memory modules enabled by fan-out redistribution layer(s) (RDLs) are provided. Memory dies may be stacked with each die having a signal pad directed to a sidewall of the die. A redistribution layer (RDL) is built on sidewalls of the stacked dies and coupled with the signal pads. The RDL may fan-out to UBM and solder balls, for example. An alternative process reconstitutes dies on a carrier with a first RDL on a front side of the dies. The dies and first RDL are encapsulated, and the modules vertically disposed for a second reconstitution on a second carrier. A second RDL is applied to exposed contacts of the vertically disposed modules and first RDLs. The vertical modules and second RDL are encapsulated in turn with a second mold material. The assembly may be singulated into individual memory modules, each with a fan-out RDL on the sidewalls of the vertically disposed dies.
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公开(公告)号：US11355443B2
公开(公告)日：2022-06-07
申请号：US16515417
申请日：2019-07-18
Applicant: Invensas Corporation
Inventor： Shaowu Huang , Javier A. Delacruz
IPC: H01L23/538 , H01L21/48 , H01L23/498 , H01L23/00 , H01L25/065
Abstract: Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.
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