Invention Grant
- Patent Title: Method and device for sensing pain
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Application No.: US15983878Application Date: 2018-05-18
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Publication No.: US10684180B2Publication Date: 2020-06-16
- Inventor: Jae Eun Jang , Kyung Hwa Lee , Minkyung Sim , Cheil Moon , Ji-Woong Choi , Hongsoo Choi
- Applicant: Daegu Gyeongbuk Institute of Science and Technology
- Applicant Address: KR Dalseong-gun, Daegu
- Assignee: Daegu Gyeongbuk Institute of Science and Technology
- Current Assignee: Daegu Gyeongbuk Institute of Science and Technology
- Current Assignee Address: KR Dalseong-gun, Daegu
- Agency: Olive Law Groups, PLLC
- Agent Nathan P. Letts
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2325270b
- Main IPC: G01L1/16
- IPC: G01L1/16 ; A61B5/00 ; G06N3/00

Abstract:
A pain sensing device includes a sensor array including a plurality of sensors that sense pressure generated due to a contact of an object and output electrical piezoelectric signals; and a signal processor configured to recognize the shape of the object based on the number of sensors that output the piezoelectric signals among the plurality of sensors, and to generate a pain signal according to the recognized shape of the object.
Public/Granted literature
- US20180266899A1 METHOD AND DEVICE FOR SENSING PAIN Public/Granted day:2018-09-20
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