Invention Grant
- Patent Title: Photoresists comprising amide component
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Application No.: US13926764Application Date: 2013-06-25
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Publication No.: US10719014B2Publication Date: 2020-07-21
- Inventor: Cong Liu , Chunyi Wu , Gerhard Pohlers , Gregory P. Prokopowicz , Mingqi Li , Cheng-Bai Xu
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/038 ; G03F7/20 ; G03F7/039 ; C08F220/52 ; C07C233/16 ; C07C233/02 ; C08F220/56 ; C07C233/00 ; C07C233/01 ; C08F220/58

Abstract:
New photoresist compositions are provided that comprise a component that comprises an amide group and multiple hydroxyl groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and an amide component with multiple hydroxyl groups that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.
Public/Granted literature
- US20130344439A1 PHOTORESISTS COMPRISING AMIDE COMPONENT Public/Granted day:2013-12-26
Information query
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