Invention Grant
- Patent Title: Electronic devices with components formed by late binding using self-assembled monolayers
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Application No.: US16399703Application Date: 2019-04-30
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Publication No.: US10734236B2Publication Date: 2020-08-04
- Inventor: Sasha N. Oster , Fay Hua , Telesphor Kamgaing , Adel A. Elsherbini , Henning Braunisch , Johanna M. Swan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes Davda & Victor LLP
- Agent Alan S. Raynes
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/285 ; H01L21/768 ; H01L21/033 ; B82Y40/00 ; H01L23/66 ; H01L25/16 ; H05K1/16 ; H05K3/28 ; H01L23/538 ; H01L21/48 ; H05K1/02 ; H05K3/34
Abstract:
Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.
Public/Granted literature
- US20190259622A1 ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SELF-ASSEMBLED MONOLAYERS Public/Granted day:2019-08-22
Information query
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