Invention Grant
- Patent Title: Antenna package and method of manufacturing the same
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Application No.: US16197352Application Date: 2018-11-20
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Publication No.: US10734704B2Publication Date: 2020-08-04
- Inventor: Cheng-Lin Ho , Chih-Cheng Lee
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q23/00 ; H01Q9/04 ; H01Q21/06 ; H01L23/66 ; H01Q21/00 ; H01L23/00

Abstract:
An antenna package includes a patterned antenna structure and an encapsulant. The patterned antenna structure includes a first surface, a second surface opposite the first surface and a third surface extended between the first surface and the second surface. The encapsulant is disposed on the first surface of the patterned antenna structure. The third surface of the patterned antenna structure includes a first portion covered by the encapsulant and a second portion exposed from the encapsulant.
Public/Granted literature
- US20200161743A1 ANTENNA PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-05-21
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