Invention Grant
- Patent Title: Method for bonding one component to another component
-
Application No.: US16016802Application Date: 2018-06-25
-
Publication No.: US10792904B2Publication Date: 2020-10-06
- Inventor: Ting-Chang Chang , Chih-Cheng Shih , Ming-Hui Wang , Wen-Chung Chen , Chih-Yang Lin
- Applicant: NATIONAL SUN YAT-SEN UNIVERSITY
- Applicant Address: TW Kaohsiung
- Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
- Current Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@73acdea7
- Main IPC: B32B37/10
- IPC: B32B37/10 ; B32B43/00 ; H01L21/18

Abstract:
A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.
Public/Granted literature
Information query