Invention Grant
- Patent Title: Polyimide film for semiconductor package reflow process, and manufacturing method therefor
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Application No.: US16329394Application Date: 2017-06-29
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Publication No.: US11015089B2Publication Date: 2021-05-25
- Inventor: Kye-Ung Lee , Ho-Young Park , Tae-Seok Lee
- Applicant: IPI TECH INC.
- Applicant Address: KR Daejeon
- Assignee: IPI TECH INC.
- Current Assignee: IPI TECH INC.
- Current Assignee Address: KR Daejeon
- Agency: Hauptman Ham, LLP
- Priority: KR10-2016-0110930 20160830
- International Application: PCT/KR2017/006871 WO 20170629
- International Announcement: WO2018/043897 WO 20180308
- Main IPC: C09J7/29
- IPC: C09J7/29 ; H01L21/683 ; H01L21/02 ; H01L21/48 ; H01L23/498 ; H01L23/488 ; B32B7/12 ; B32B27/08 ; B32B27/28 ; H01L23/00 ; H01L21/56
Abstract:
Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
Public/Granted literature
- US20190194496A1 POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFACTURING METHOD THEREFOR Public/Granted day:2019-06-27
Information query
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