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1.
公开(公告)号:US20190194496A1
公开(公告)日:2019-06-27
申请号:US16329394
申请日:2017-06-29
Applicant: IPI TECH INC.
Inventor: Kye-Ung LEE , Ho-Young PARK , Tae-Seok LEE
CPC classification number: C09J7/29 , B32B7/12 , B32B27/08 , B32B27/281 , C09J2203/326 , C09J2479/086 , H01L21/02 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/488 , H01L23/498 , H01L24/50 , H01L2924/07025
Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
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2.
公开(公告)号:US11015089B2
公开(公告)日:2021-05-25
申请号:US16329394
申请日:2017-06-29
Applicant: IPI TECH INC.
Inventor: Kye-Ung Lee , Ho-Young Park , Tae-Seok Lee
IPC: C09J7/29 , H01L21/683 , H01L21/02 , H01L21/48 , H01L23/498 , H01L23/488 , B32B7/12 , B32B27/08 , B32B27/28 , H01L23/00 , H01L21/56
Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
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3.
公开(公告)号:US20210043935A1
公开(公告)日:2021-02-11
申请号:US16964313
申请日:2019-01-21
Applicant: IPI TECH INC.
Inventor: Seung Wan SONG , Hieu QUANG PHAM , Hyun Min JUNG
Abstract: The present invention relates to a binder for a lithium secondary battery, an electrode comprising the same, and a lithium secondary battery comprising the electrode. More specifically, the present invention provides a binder for a lithium secondary battery having excellent cycle life and high energy density, an anode for a lithium secondary battery comprising the same, and a lithium secondary battery prepared therefrom.
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4.
公开(公告)号:US11817584B2
公开(公告)日:2023-11-14
申请号:US16964313
申请日:2019-01-21
Applicant: IPI TECH INC.
Inventor: Seung Wan Song , Hieu Quang Pham , Hyun Min Jung
IPC: H01M4/62 , C08K3/11 , C08G73/10 , C08K3/04 , C08K3/22 , H01M4/505 , H01M4/525 , H01M10/0525 , H01M4/02
CPC classification number: H01M4/622 , C08G73/1067 , C08K3/04 , C08K3/11 , C08K3/22 , H01M4/505 , H01M4/525 , H01M10/0525 , C08K2003/2203 , C08K2003/2262 , C08K2003/2289 , C08K2003/2293 , C08K2201/001 , C08K2201/003 , H01M2004/028
Abstract: The present invention relates to a binder for a lithium secondary battery, an electrode comprising the same, and a lithium secondary battery comprising the electrode. More specifically, the present invention provides a binder for a lithium secondary battery having excellent cycle life and high energy density, an anode for a lithium secondary battery comprising the same, and a lithium secondary battery prepared therefrom.
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公开(公告)号:US11492519B2
公开(公告)日:2022-11-08
申请号:US17274390
申请日:2019-06-18
Applicant: IPI TECH INC
Inventor: Kye Ung Lee , Ju Hwan Chun , Ho Young Park , Tae Seok Lee
Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
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