公开(公告)号：US11015089B2

公开(公告)日：2021-05-25

申请号：US16329394

申请日：2017-06-29

Applicant: IPI TECH INC.

Inventor： Kye-Ung Lee ,  Ho-Young Park ,  Tae-Seok Lee

IPC: C09J7/29 ,  H01L21/683 ,  H01L21/02 ,  H01L21/48 ,  H01L23/498 ,  H01L23/488 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  H01L23/00 ,  H01L21/56

Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.