Invention Grant
- Patent Title: Bottom-up gap-fill by surface poisoning treatment
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Application No.: US15297270Application Date: 2016-10-19
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Publication No.: US11028477B2Publication Date: 2021-06-08
- Inventor: Mark Saly , Keiichi Tanaka , Eswaranand Venkatasubramanian , Mandyam Sriram , Bhaskar Jyoti Bhuyan , Pramit Manna , David Thompson , Andrew Short
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/04
- IPC: C23C16/04 ; C23C16/455 ; C23C16/34 ; H01L21/02 ; C23C16/02 ; C23C16/40 ; H01L21/762
Abstract:
Methods for depositing film comprising exposing a substrate surface to an organic-based poisoning agent to preferentially inhibit film growth at the top of a feature relative to the bottom of the feature and depositing a film. The substrate can be exposed to the poisoning agent any number of times to promote bottom-up growth of the film in the feature.
Public/Granted literature
- US20170114459A1 Bottom-Up Gap-Fill by Surface Poisoning Treatment Public/Granted day:2017-04-27
Information query
IPC分类:
