Invention Grant
- Patent Title: Integrated circuit fabrication system with adjustable gas injector and method utilizing the same
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Application No.: US16727688Application Date: 2019-12-26
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Publication No.: US11043388B2Publication Date: 2021-06-22
- Inventor: Yung-Shun Hsu , Ching-Yu Chang , Chiao-Kai Chang , Wai Hong Cheah , Chien-Fang Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/3065 ; H01L21/67 ; H01J37/32 ; H01L21/3213
Abstract:
The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.
Information query
IPC分类:
