公开(公告)号：US11043388B2

公开(公告)日：2021-06-22

申请号：US16727688

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01L21/306 ,  H01L21/3065 ,  H01L21/67 ,  H01J37/32 ,  H01L21/3213

Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.

公开(公告)号：US20190385816A1

公开(公告)日：2019-12-19

申请号：US16007780

申请日：2018-06-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.

公开(公告)号：US11670490B2

公开(公告)日：2023-06-06

申请号：US15864807

申请日：2018-01-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/3213

CPC classification number: H01J37/3244 ,  H01J37/32 ,  H01J37/32449 ,  H01J37/32733 ,  H01L21/3065 ,  H01L21/32136 ,  H01L21/67069 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67201 ,  H01J2237/20214 ,  H01J2237/334

Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.

公开(公告)号：US20190103295A1

公开(公告)日：2019-04-04

申请号：US15864807

申请日：2018-01-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01L21/67 ,  H01J37/32

Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.

公开(公告)号：US11854769B2

公开(公告)日：2023-12-26

申请号：US17833404

申请日：2022-06-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01J37/3244 ,  H01J37/3211 ,  H01J37/32715 ,  H01J37/32963 ,  H01L21/67069 ,  H01L22/26 ,  H01J2237/20214 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/32136 ,  H01L21/67167 ,  H01L21/6831

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.

公开(公告)号：US11361943B2

公开(公告)日：2022-06-14

申请号：US17072861

申请日：2020-10-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01J37/32 ,  H01L21/3213 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/311

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.

公开(公告)号：US11355318B2

公开(公告)日：2022-06-07

申请号：US17072866

申请日：2020-10-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Shun Hsu ,  Ching-Yu Chang ,  Chiao-Kai Chang ,  Wai Hong Cheah ,  Chien-Fang Lin

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.