Invention Grant
- Patent Title: Mask blank, phase shift mask, method for manufacturing phase shift mask, and method for manufacturing semiconductor device
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Application No.: US16318216Application Date: 2017-06-22
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Publication No.: US11054735B2Publication Date: 2021-07-06
- Inventor: Takenori Kajiwara , Ryo Ohkubo , Hiroaki Shishido , Osamu Nozawa
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JPJP2016-141222 20160719
- International Application: PCT/JP2017/023032 WO 20170622
- International Announcement: WO2018/016262 WO 20180125
- Main IPC: G03F1/32
- IPC: G03F1/32 ; G03F1/74 ; G03F1/26 ; G03F1/80 ; H01L21/033

Abstract:
A mask blank having fast repair rate of EB defect repair and high repair rate ratio to EB defect repair relative to a transparent substrate that includes a phase shift film on a transparent substrate, the phase shift film has a structure including three sets or more of a set of a stacked structure including a high transmitting layer and a low transmitting layer, the high transmitting layer and the low transmitting layer are made of a material consisting of silicon and nitrogen, or a material consisting of silicon, nitrogen, oxygen, and one or more elements selected from a metalloid element and a non-metallic element, the high transmitting layer includes 50 atom % or more nitrogen content and has a thickness of 12 nm or less, and the low transmitting layer includes less than 50 atom % nitrogen content and has a thickness less than the high transmitting layer.
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