Invention Grant
- Patent Title: Sensor package structure and sensing module thereof
-
Application No.: US16744845Application Date: 2020-01-16
-
Publication No.: US11133348B2Publication Date: 2021-09-28
- Inventor: Li-Chun Hung , Chien-Chen Lee , Jian-Ru Chen , Chen-Pin Peng
- Applicant: KINGPAK TECHNOLOGY INC.
- Applicant Address: TW Hsin-Chu County
- Assignee: KINGPAK TECHNOLOGY INC.
- Current Assignee: KINGPAK TECHNOLOGY INC.
- Current Assignee Address: TW Hsin-Chu County
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00

Abstract:
A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ⅓ of the first distance.
Public/Granted literature
- US20200350357A1 SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF Public/Granted day:2020-11-05
Information query
IPC分类: