Invention Grant
- Patent Title: Methods of reducing sinuous flow during machining and products formed thereby
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Application No.: US16571625Application Date: 2019-09-16
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Publication No.: US11135616B2Publication Date: 2021-10-05
- Inventor: Ho Yeung , Koushik Viswanathan , Walter Dale Compton , Srinivasan Chandrasekar
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Hartman Global IP Law
- Agent Gary M. Hartman; Domenica N. S. Hartman
- Main IPC: B05D3/00
- IPC: B05D3/00 ; B23B1/00 ; B23B25/02

Abstract:
Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.
Public/Granted literature
- US20200023405A1 METHODS OF REDUCING SINUOUS FLOW DURING MACHINING AND PRODUCTS FORMED THEREBY Public/Granted day:2020-01-23
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