公开(公告)号：US10413934B2

公开(公告)日：2019-09-17

申请号：US15212935

申请日：2016-07-18

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23C3/00 ,  B23B25/02 ,  B23B1/00

Abstract: Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.

公开(公告)号：US11135616B2

公开(公告)日：2021-10-05

申请号：US16571625

申请日：2019-09-16

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23B1/00 ,  B23B25/02

Abstract: Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.

公开(公告)号：US20200023405A1

公开(公告)日：2020-01-23

申请号：US16571625

申请日：2019-09-16

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23B1/00 ,  B23B25/02

Abstract: Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.

公开(公告)号：US20170014862A1

公开(公告)日：2017-01-19

申请号：US15212935

申请日：2016-07-18

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23C3/00 ,  B23B25/02

CPC classification number: B05D3/002 ,  B05D2202/00 ,  B23B1/00 ,  B23B25/02 ,  B23B2228/10 ,  B23B2228/24 ,  B23B2228/28

Abstract: Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.

Abstract translation: 提供了加工机身以制造芯片的方法，其中主体由材料形成并且处于使得在加工操作期间材料呈现弯曲状态的状态。 所述方法包括提供位于主体表面上的层，并且通过在其上具有涂层的表面的区域下方的接触区域中引起切削工具和主体之间的接合来加工主体，并且相对于 制造具有其上的层的芯片的主体。 该层减少了主体材料中的弯曲流动，并且芯片主要由层流形成。