公开(公告)号：US20160018811A1

公开(公告)日：2016-01-21

申请号：US14802804

申请日：2015-07-17

Applicant: Purdue Research Foundation

Inventor： Dinakar Sagapuram ,  Kevin Paul Trumble ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: G05B19/18

CPC classification number: G05B19/182 ,  B23B1/00 ,  B23B2222/12 ,  B23B2222/21 ,  B23B2222/52 ,  B23B2222/64 ,  B23B2222/88 ,  B23B2270/30 ,  G05B2219/31376 ,  G05B2219/45044

Abstract: A method for controlling flow localization in machining process is disclosed. By application of a constraint of sufficient level in the deformation zone and modifying the surface boundary conditions, suppression of unsteady flow and flow instabilities is achieved. The method enhances machined component quality by ensuring a uniform deformation state on the machined surface. Machined components are produced by ensuing uniform deformation by adopting constrained-cutting process for suppressing the instabilities and unsteady flow through a pre-determined location of the constraint of the constrained machining process relative to the machining tool.

Abstract translation: 公开了一种用于控制加工过程中流动定位的方法。 通过在变形区域施加足够水平的约束并修改表面边界条件，实现了不稳定流动和流动不稳定性的抑制。 该方法通过确保加工表面上的均匀变形状态来提高加工零件质量。 通过采用约束切割工艺来抑制不稳定性和不稳定流动通过约束加工过程相对于加工工具的约束的预定位置，由此产生加工部件。

公开(公告)号：US10413934B2

公开(公告)日：2019-09-17

申请号：US15212935

申请日：2016-07-18

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23C3/00 ,  B23B25/02 ,  B23B1/00

Abstract: Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.

公开(公告)号：US11135616B2

公开(公告)日：2021-10-05

申请号：US16571625

申请日：2019-09-16

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23B1/00 ,  B23B25/02

Abstract: Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.

公开(公告)号：US20200023405A1

公开(公告)日：2020-01-23

申请号：US16571625

申请日：2019-09-16

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23B1/00 ,  B23B25/02

Abstract: Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.

公开(公告)号：US20170014862A1

公开(公告)日：2017-01-19

申请号：US15212935

申请日：2016-07-18

Applicant: Purdue Research Foundation

Inventor： Ho Yeung ,  Koushik Viswanathan ,  Walter Dale Compton ,  Srinivasan Chandrasekar

IPC: B05D3/00 ,  B23C3/00 ,  B23B25/02

CPC classification number: B05D3/002 ,  B05D2202/00 ,  B23B1/00 ,  B23B25/02 ,  B23B2228/10 ,  B23B2228/24 ,  B23B2228/28

Abstract: Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.

Abstract translation: 提供了加工机身以制造芯片的方法，其中主体由材料形成并且处于使得在加工操作期间材料呈现弯曲状态的状态。 所述方法包括提供位于主体表面上的层，并且通过在其上具有涂层的表面的区域下方的接触区域中引起切削工具和主体之间的接合来加工主体，并且相对于 制造具有其上的层的芯片的主体。 该层减少了主体材料中的弯曲流动，并且芯片主要由层流形成。