Invention Grant
- Patent Title: Substrate structure with high reflectance and method for manufacturing the same
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Application No.: US16894883Application Date: 2020-06-08
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Publication No.: US11147157B2Publication Date: 2021-10-12
- Inventor: Cheng-I Tu , Ying-Hsing Chen , Meng-Huan Chia , Hsin-Ching Su , Yi-Chun Liu , Cheng-Chung Lai , Yuan-Chih Lee
- Applicant: UNIFLEX Technology Inc.
- Applicant Address: TW Taichung
- Assignee: UNIFLEX Technology Inc.
- Current Assignee: UNIFLEX Technology Inc.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW108105862 20190221
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/03 ; H05K3/46 ; H05K3/28 ; H01L33/60 ; H01L33/62

Abstract:
A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
Public/Granted literature
- US20200305276A1 SUBSTRATE STRUCTURE WITH HIGH REFLECTANCE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-09-24
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