公开(公告)号：US20200305276A1

公开(公告)日：2020-09-24

申请号：US16894883

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/46

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US11937370B2

公开(公告)日：2024-03-19

申请号：US17463571

申请日：2021-09-01

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H05K1/115 ,  H05K3/28 ,  H05K3/46 ,  H05K3/4605 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0313 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

公开(公告)号：US11140773B2

公开(公告)日：2021-10-05

申请号：US16894882

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US20200305275A1

公开(公告)日：2020-09-24

申请号：US16894882

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/46

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US11979980B2

公开(公告)日：2024-05-07

申请号：US17406078

申请日：2021-08-19

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H01L21/02 ,  H01L21/768 ,  H01L23/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H01L21/02496 ,  H01L21/76846 ,  H01L24/83 ,  H05K1/056 ,  H05K1/115 ,  H05K3/28 ,  H05K3/384 ,  H05K3/46 ,  H05K3/4605 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0313 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

公开(公告)号：US11147157B2

公开(公告)日：2021-10-12

申请号：US16894883

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US20210400805A1

公开(公告)日：2021-12-23

申请号：US17463571

申请日：2021-09-01

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

公开(公告)号：US20210385943A1

公开(公告)日：2021-12-09

申请号：US17406078

申请日：2021-08-19

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

公开(公告)号：US10729007B2

公开(公告)日：2020-07-28

申请号：US16387540

申请日：2019-04-18

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.