公开(公告)号：US20200305276A1

公开(公告)日：2020-09-24

申请号：US16894883

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/46

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US11140773B2

公开(公告)日：2021-10-05

申请号：US16894882

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US20200305275A1

公开(公告)日：2020-09-24

申请号：US16894882

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/46

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US09860978B1

公开(公告)日：2018-01-02

申请号：US15458047

申请日：2017-03-14

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Pei-Hao Hung ,  Ying-Hsing Chen ,  Chiu-Pei Huang ,  Min-Ming Tsai ,  Shan-Yi Tseng ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/05

CPC classification number: H05K1/0281 ,  H05K1/0277 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/115 ,  H05K3/4691 ,  H05K2201/041

Abstract: A rigid-flex board structure includes a flexible printed circuit (FPC) board, a substrate, a reinforcing layer, a patterned circuit layer and a plurality of conductive vias. The FPC board includes at least one exposing area. The substrate is disposed on the FPC board and includes an opening exposing the exposing area. The reinforcing layer is embedded in the substrate and a rigidity of a material of the reinforcing layer is greater than a rigidity of a material of the substrate. The patterned circuit layer is disposed on the substrate. The conductive vias are configured to electrically connect the patterned circuit layer and the FPC board.

公开(公告)号：US11979980B2

公开(公告)日：2024-05-07

申请号：US17406078

申请日：2021-08-19

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H01L21/02 ,  H01L21/768 ,  H01L23/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H01L21/02496 ,  H01L21/76846 ,  H01L24/83 ,  H05K1/056 ,  H05K1/115 ,  H05K3/28 ,  H05K3/384 ,  H05K3/46 ,  H05K3/4605 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0313 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

公开(公告)号：US11147157B2

公开(公告)日：2021-10-12

申请号：US16894883

申请日：2020-06-08

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

公开(公告)号：US11937370B2

公开(公告)日：2024-03-19

申请号：US17463571

申请日：2021-09-01

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H05K1/115 ,  H05K3/28 ,  H05K3/46 ,  H05K3/4605 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0313 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

公开(公告)号：US10580951B2

公开(公告)日：2020-03-03

申请号：US16040546

申请日：2018-07-20

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

公开(公告)号：US20190305200A1

公开(公告)日：2019-10-03

申请号：US16040546

申请日：2018-07-20

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

公开(公告)号：US20210400805A1

公开(公告)日：2021-12-23

申请号：US17463571

申请日：2021-09-01

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.