Invention Grant
- Patent Title: Standard cell layout architectures and drawing styles for 5nm and beyond
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Application No.: US15636245Application Date: 2017-06-28
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Publication No.: US11211330B2Publication Date: 2021-12-28
- Inventor: Richard T. Schultz
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Kowert Hood Munyon Rankin and Goetzel PC
- Agent Rory D. Rankin
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L29/786 ; H01L29/423 ; H01L29/45 ; H01L29/417 ; H01L21/768 ; H01L27/02 ; H01L29/49 ; G06F30/39 ; G06F30/392 ; H01L21/8234 ; H01L21/8238

Abstract:
A system and method for efficiently creating layout for a standard cell are described. A standard cell to be used for an integrated circuit uses a full trench silicide strap as drain regions for a pmos transistor and an nmos transistor. Multiple unidirectional routes in metal zero are placed across the standard cell where each route connects to a trench silicide contact. Power and ground connections utilize pins rather than end-to-end rails in the standard cell. Additionally, intermediate nodes are routed in the standard cell with unidirectional routes.
Public/Granted literature
- US20180315709A1 STANDARD CELL LAYOUT ARCHITECTURES AND DRAWING STYLES FOR 5NM AND BEYOND Public/Granted day:2018-11-01
Information query
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