Invention Grant
- Patent Title: Curable composition
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Application No.: US16639115Application Date: 2018-08-03
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Publication No.: US11261358B2Publication Date: 2022-03-01
- Inventor: Kazunobu Takami , Takatomi Nishida
- Applicant: Sunstar Engineering Inc.
- Applicant Address: JP Osaka
- Assignee: Sunstar Engineering Inc.
- Current Assignee: Sunstar Engineering Inc.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2017-159758 20170822
- International Application: PCT/JP2018/029168 WO 20180803
- International Announcement: WO2019/039230 WO 20190228
- Main IPC: C09J163/04
- IPC: C09J163/04 ; C08G59/24 ; C08G59/50 ; C08G59/68

Abstract:
The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion.
The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
Public/Granted literature
- US20200208029A1 CURABLE COMPOSITION Public/Granted day:2020-07-02
Information query
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