公开(公告)号：US11261358B2

公开(公告)日：2022-03-01

申请号：US16639115

申请日：2018-08-03

Applicant: Sunstar Engineering Inc.

Inventor： Kazunobu Takami ,  Takatomi Nishida

IPC: C09J163/04 ,  C08G59/24 ,  C08G59/50 ,  C08G59/68

Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion.
The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.