Invention Grant
- Patent Title: Device attachment with dual band imaging sensor
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Application No.: US15199867Application Date: 2016-06-30
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Publication No.: US11297264B2Publication Date: 2022-04-05
- Inventor: Per Elmfors , Michael Kent
- Applicant: FLIR Systems, Inc.
- Applicant Address: US OR Wilsonville
- Assignee: FLIR Systems, Inc.
- Current Assignee: FLIR Systems, Inc.
- Current Assignee Address: US OR Wilsonville
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/33 ; G01J5/02 ; G01J5/04 ; G01J5/08 ; H04N5/225 ; H04N13/128 ; H04N13/156 ; H04N13/246 ; H04N13/296 ; H04N13/239 ; H04N13/25 ; G01J5/00 ; G01J5/52 ; H04M1/18 ; H04N13/254 ; H04N13/00

Abstract:
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.
Public/Granted literature
- US20160316154A1 DEVICE ATTACHMENT WITH DUAL BAND IMAGING SENSOR Public/Granted day:2016-10-27
Information query
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