TECHNIQUES FOR DEVICE ATTACHMENT WITH DUAL BAND IMAGING SENSOR
    9.
    发明申请
    TECHNIQUES FOR DEVICE ATTACHMENT WITH DUAL BAND IMAGING SENSOR 审中-公开
    用于双带成像传感器的设备连接技术

    公开(公告)号:US20160316119A1

    公开(公告)日:2016-10-27

    申请号:US15199861

    申请日:2016-06-30

    Inventor: Michael Kent

    Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.

    Abstract translation: 公开了用于提供被配置为可释放地附接到移动电话或其他便携式电子设备并向其提供红外成像功能的设备附件的各种技术。 设备附件可以包括红外想象模块和非热成像模块,其与连接的设备中的非热成像模块和附接设备中的光源的一个或多个配合,用于捕获和处理图像。

Patent Agency Ranking