Invention Grant
- Patent Title: High electron mobility transistor
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Application No.: US16601570Application Date: 2019-10-14
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Publication No.: US11322600B2Publication Date: 2022-05-03
- Inventor: An-Chi Liu , Chun-Hsien Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201910874778.8 20190917
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/66 ; H01L29/201 ; H01L29/40 ; H01L29/778

Abstract:
A high electron mobility transistor (HEMT) includes a buffer layer on a substrate, a barrier layer on the buffer layer, a gate electrode on the barrier layer, a first passivation layer adjacent to two sides of the gate electrode, and a p-type semiconductor layer between the gate electrode and the barrier layer. Preferably, a corner of the p-type semiconductor layer contacting a sidewall of the first passivation layer includes a first curve, and a bottom surface of the p-type semiconductor layer directly on the first passivation layer includes a second curve.
Public/Granted literature
- US20210083073A1 HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2021-03-18
Information query
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