Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
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Application No.: US16933806Application Date: 2020-07-20
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Publication No.: US11443997B2Publication Date: 2022-09-13
- Inventor: Wei Chih Cho , Chun Chen Chen , Shao-Lun Yang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L25/00 ; H01L25/18 ; H01L25/065
Abstract:
A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.
Public/Granted literature
- US20220020654A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-01-20
Information query
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