Invention Grant
- Patent Title: Scalable, high load, low stiffness, and small footprint loading mechanism
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Application No.: US15942280Application Date: 2018-03-30
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Publication No.: US11449111B2Publication Date: 2022-09-20
- Inventor: Eric W. Buddrius , Ralph V. Miele , Mohanraj Prabhugoud , David Shia , Jeffory L. Smalley
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K7/14 ; H05K7/18 ; H05K7/16 ; H05K7/10

Abstract:
A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
Public/Granted literature
- US20190302857A1 SCALABLE, HIGH LOAD, LOW STIFFNESS, AND SMALL FOOTPRINT LOADING MECHANISM Public/Granted day:2019-10-03
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