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公开(公告)号:US11818832B2
公开(公告)日:2023-11-14
申请号:US16828447
申请日:2020-03-24
Applicant: Intel Corporation
Inventor: Feroz Mohammad , Ralph V. Miele , Thomas Boyd , Steven A. Klein , Gregorio R. Murtagian , Eric W. Buddrius , Daniel Neumann , Rolf Laido
CPC classification number: H05K1/0203 , H05K7/20509 , H01L2023/405 , H01L2023/4087 , H01R12/85 , H05K1/181 , H05K2201/10325
Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.
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公开(公告)号:US11567508B2
公开(公告)日:2023-01-31
申请号:US16649584
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Andrew Larson , Subhas Balappanavar , Daniel Pohl , Koba Natroshvili , Cornelius Buerkle , Ellann Cohen , Andreas Herden , Ralph V. Miele , David Pidwerbecki , Roman Schick , Henning Schroeder , Mark E. Sprenger
IPC: B64C39/02 , G05D1/00 , B64D47/08 , G08G5/00 , G05D1/02 , H04N5/76 , H04N13/243 , H04N5/225 , H04N5/247
Abstract: Autonomous unmanned vehicles (UVs) for responding to situations are described. Embodiments include UVs that launch upon detection of a situation, operate in the area of the situation, and collect and send information about the situation. The UVs may launch from a vehicle involved in the situation, a vehicle responding to the situation, or from a fixed station. In other embodiments, the UVs also provide communications relays to the situation and may facilitate access to the situation by responders. The UVs further may act as decoupled sensors for vehicles. In still other embodiments, the collected information may be used to recreate the situation as it happened.
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公开(公告)号:US10455685B1
公开(公告)日:2019-10-22
申请号:US16159840
申请日:2018-10-15
Applicant: Intel Corporation
Inventor: Steven A. Klein , Kuang Liu , Thomas A. Boyd , Luis Gil Rangel , Muffadal Mukadem , Shelby A. Ferguson , Francis Toth, Jr. , Eric Buddrius , Ralph V. Miele , Sriram Srinivasan , Jeffory L. Smalley
IPC: H01L23/522 , H01L23/485 , H01L23/32 , H05K1/02 , H05K3/30 , H01R12/70 , H05K7/10 , H01L23/367 , H05K3/36
Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.
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公开(公告)号:US09727092B1
公开(公告)日:2017-08-08
申请号:US15013110
申请日:2016-02-02
Applicant: Intel Corporation
Inventor: Dan H. Gerbus , Ralph V. Miele
IPC: G06F1/16
CPC classification number: G06F1/1681 , G06F1/1632 , G06F1/1654 , G06F1/1669
Abstract: Embodiments of the present disclosure pertain to a computer dock that can engage a friction element upon receiving a computing device, such as a tablet. The computer dock includes a housing coupled to the computer dock, the housing comprising a cradle to receive a computing device, the housing coupled to the computer dock by a hinge pin and configured to rotate about the hinge pin about a first axis; a friction hinge rigidly affixed to the computer dock; a pivot arm affixed to the housing, the pivot arm configured to rotate about a pivot point. The pivot arm includes a first portion comprising a computing device engagement part to receive the computing device; and a second portion comprising a friction hinge engagement part to engage with the friction hinge upon receiving the computing device in the cradle.
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公开(公告)号:US20170220076A1
公开(公告)日:2017-08-03
申请号:US15013110
申请日:2016-02-02
Applicant: Intel Corporation
Inventor: Dan H. Gerbus , Ralph V. Miele
IPC: G06F1/16
CPC classification number: G06F1/1681 , G06F1/1632 , G06F1/1654 , G06F1/1669
Abstract: Embodiments of the present disclosure pertain to a computer dock that can engage a friction element upon receiving a computing device, such as a tablet. The computer dock includes a housing coupled to the computer dock, the housing comprising a cradle to receive a computing device, the housing coupled to the computer dock by a hinge pin and configured to rotate about the hinge pin about a first axis; a friction hinge rigidly affixed to the computer dock; a pivot arm affixed to the housing, the pivot arm configured to rotate about a pivot point. The pivot arm includes a first portion comprising a computing device engagement part to receive the computing device; and a second portion comprising a friction hinge engagement part to engage with the friction hinge upon receiving the computing device in the cradle.
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公开(公告)号:US12131977B2
公开(公告)日:2024-10-29
申请号:US18498891
申请日:2023-10-31
Applicant: Intel Corporation
Inventor: Barrett M. Faneuf , Phil Geng , Kenan Arik , David Shia , Casey Winkel , Sandeep Ahuja , Eric D. McAfee , Jeffory L Smalley , Minh T. D. Le , Ralph V. Miele , Marc Milobinski , Aaron P. Anderson , Brendan T. Pavelek , Carlos Alvizo Flores , Fernando Gonzalez Lenero
IPC: H01L23/367 , G11C5/06 , H05K7/14 , H05K7/20
CPC classification number: H01L23/3677 , G11C5/06 , H05K7/1422 , H05K7/20509
Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.
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公开(公告)号:US11449111B2
公开(公告)日:2022-09-20
申请号:US15942280
申请日:2018-03-30
Applicant: INTEL CORPORATION
Inventor: Eric W. Buddrius , Ralph V. Miele , Mohanraj Prabhugoud , David Shia , Jeffory L. Smalley
Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
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公开(公告)号:US10600138B2
公开(公告)日:2020-03-24
申请号:US16088241
申请日:2016-03-25
Applicant: Intel Corporation
Inventor: Elizabeth Stortstrom , Andrew Larson , Mark E. Sprenger , Ralph V. Miele
Abstract: Systems, apparatuses and methods of monitoring the utilization of protective equipment by individuals requesting access to a restricted area that requires the use of specific protective equipment, are provided. A protective equipment checker, which includes a proximity sensor, a three-dimensional (3D) camera, and a radio-frequency identification (RFID) reader, performs a full body scan on the individual to determine if the location-specific protective equipment is being worn, or is in the possession of the individual. If a determination is made that the proper protective equipment is being worn, the individual is granted access to the location. If, one the other hand, the required protective equipment is not being worn, entry to the location is denied.
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公开(公告)号:US20190304870A1
公开(公告)日:2019-10-03
申请号:US15942270
申请日:2018-03-30
Applicant: Intel Corporation
Inventor: Thomas Boyd , Ming-Chen Chang , Evan A. Chenelly , Divya Swamy Bandaru , Craig J. Jahne , Andrew Larson , Eric W. Buddrius , Eric D. McAfee , Mustafa Haswarey , Ralph V. Miele , Rolf Laido
IPC: H01L23/40 , H05K7/14 , H01L23/367
Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
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公开(公告)号:US20190304869A1
公开(公告)日:2019-10-03
申请号:US15942278
申请日:2018-03-30
Applicant: Intel Corporation
Inventor: Andrew Larson , Bijoyraj Sahu , Craig J. Jahne , Eric W. Buddrius , Ralph V. Miele
Abstract: A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
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