Invention Grant
- Patent Title: Microelectronic structures including bridges
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Application No.: US16902768Application Date: 2020-06-16
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Publication No.: US11521931B2Publication Date: 2022-12-06
- Inventor: Jason M. Gamba , Nitin A. Deshpande , Mohit Bhatia , Omkar G. Karhade , Bai Nie , Gang Duan , Kristof Kuwawi Darmawikarta , Wei-Lun Jen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/498
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Public/Granted literature
- US20210391266A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES Public/Granted day:2021-12-16
Information query
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