公开(公告)号：US11804441B2

公开(公告)日：2023-10-31

申请号：US16902910

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Debendra Mallik

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L25/18

CPC classification number: H01L23/5385 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/73253

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate including a first metal layer and a second metal layer; a cavity in the substrate, wherein a portion of the first metal layer in the substrate and a portion of the second metal layer in the substrate are exposed in the cavity; and a bridge component in the cavity, the bridge component includes a first conductive contact at a first face and a second conductive contacts at an opposing second face, wherein the second face of the bridge component is between the first face of the bridge component and a bottom surface of the cavity in the substrate, and wherein the second conductive contact is electrically coupled to the portion of the first metal layer in the cavity.

公开(公告)号：US20220270998A1

公开(公告)日：2022-08-25

申请号：US17740501

申请日：2022-05-10

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Anurag Tripathi ,  Takeshi Nakazawa ,  Steve Cho

IPC: H01L23/00 ,  H01L23/538

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20210391266A1

公开(公告)日：2021-12-16

申请号：US16902768

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Jason M. Gamba ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Omkar G. Karhade ,  Bai Nie ,  Gang Duan ,  Kristof Kuwawi Darmawikarta ,  Wei-Lun Jen

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20210391273A1

公开(公告)日：2021-12-16

申请号：US16902777

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Omkar G. Karhade ,  Nitin A. Deshpande ,  Jinhe Liu ,  Sairam Agraharam ,  Mohit Bhatia ,  Edvin Cetegen

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20210391268A1

公开(公告)日：2021-12-16

申请号：US16902910

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Debendra Mallik

IPC: H01L23/538 ,  H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US11521931B2

公开(公告)日：2022-12-06

申请号：US16902768

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Jason M. Gamba ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Omkar G. Karhade ,  Bai Nie ,  Gang Duan ,  Kristof Kuwawi Darmawikarta ,  Wei-Lun Jen

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US11373972B2

公开(公告)日：2022-06-28

申请号：US16902887

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Anurag Tripathi ,  Takeshi Nakazawa ,  Steve Cho

IPC: H01L23/538 ,  H01L23/00

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20210391295A1

公开(公告)日：2021-12-16

申请号：US16902927

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Sairam Agraharam ,  Edvin Cetegen ,  Anurag Tripathi ,  Malavarayan Sankarasubramanian ,  Jan Krajniak ,  Manish Dubey ,  Jinhe Liu ,  Wei Li ,  Jingyi Huang

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/498

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20250006695A1

公开(公告)日：2025-01-02

申请号：US18344260

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Bhaskar Jyoti Krishnatreya ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Kimin Jun ,  Omkar G. Karhade ,  Mohit Bhatia ,  Nitin A. Deshpande ,  Prashant Majhi ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first layer with a first die having a first contact; a second die having a second contact; and a pad layer, on the first and second dies, including a first pad and a second pad, where the first pad is coupled to and offset from the first contact in a first direction, and the second pad is coupled to and is offset from the second contact in a second direction different than the first direction; and a second layer including a third die having third and fourth contacts, where the first layer is coupled to the second layer by metal-to-metal bonds and fusion bonds, the first contact is coupled to the third contact by the first pad, and the second contact is coupled to the fourth contact by the second pad.

公开(公告)号：US20250006651A1

公开(公告)日：2025-01-02

申请号：US18345820

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Francisco Maya ,  Khant Minn ,  Suresh V. Pothukuchi ,  Arnab Sarkar ,  Mohit Bhatia ,  Bhaskar Jyoti Krishnatreya ,  Siyan Dong

IPC: H01L23/544 ,  H01L23/00

Abstract: An apparatus comprising a first integrated circuit device, the first integrated circuit device comprising a fiducial having a length size greater than a width size of the fiducial, wherein the fiducial comprises at least one first area and at least one second area, wherein the at least one first area is to stop light from a light source and the at least one second area is to pass light from the light source during a determination of an alignment between the first integrated circuit device and a second integrated circuit device.