Invention Grant
- Patent Title: Method of manufacturing head chip and method of manufacturing liquid jet head
-
Application No.: US16670203Application Date: 2019-10-31
-
Publication No.: US11548283B2Publication Date: 2023-01-10
- Inventor: Suguru Munakata , Yuji Nakamura , Yuzuru Kubota , Daiki Irokawa
- Applicant: SII Printek Inc.
- Applicant Address: JP Chiba
- Assignee: SII Printek Inc.
- Current Assignee: SII Printek Inc.
- Current Assignee Address: JP Chiba
- Agency: Crowell & Moring LLP
- Priority: JPJP2018-211729 20181109
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B23K26/362

Abstract:
There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.
Public/Granted literature
- US20200147969A1 METHOD OF MANUFACTURING HEAD CHIP AND METHOD OF MANUFACTURING LIQUID JET HEAD Public/Granted day:2020-05-14
Information query
IPC分类: