公开(公告)号：US11072176B2

公开(公告)日：2021-07-27

申请号：US16675608

申请日：2019-11-06

Applicant: SII Printek Inc.

Inventor： Hitoshi Nakayama ,  Yuji Nakamura ,  Yuki Yamamura ,  Mizuki Kudo

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/165

Abstract: A liquid jet head chip capable of exerting a stable ejection performance is provided. The liquid jet head chip is provided with an actuator plate and an electrode. The actuator plate has an obverse surface, a reverse surface, and two or more ejection channels which penetrate the actuator plate in a thickness direction from the obverse surface toward the reverse surface, which are disposed so as to be adjacent to each other at intervals in a first direction perpendicular to the thickness direction, and which are disposed so as to extend in a second direction perpendicular to both of the thickness direction and the first direction. The electrode is disposed on an inner surface of the ejection channel, and includes a first electrode part covering the inner surface of the ejection channel continuously from the obverse surface toward the reverse surface, and a second electrode part covering the inner surface of the ejection channel continuously from the reverse surface toward the obverse surface, and overlapping at least a part of the first electrode part.

公开(公告)号：US20210187950A1

公开(公告)日：2021-06-24

申请号：US17123393

申请日：2020-12-16

Applicant: SII PRINTEK INC.

Inventor： Suguru Munakata ,  Daichi Nishikawa ,  Yuzuru Kubota ,  Yuki Yamamura ,  Yuji Nakamura

IPC: B41J2/16

Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

公开(公告)号：US11548283B2

公开(公告)日：2023-01-10

申请号：US16670203

申请日：2019-10-31

Applicant: SII Printek Inc.

Inventor： Suguru Munakata ,  Yuji Nakamura ,  Yuzuru Kubota ,  Daiki Irokawa

IPC: B41J2/16 ,  B23K26/362

Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

公开(公告)号：US20200147969A1

公开(公告)日：2020-05-14

申请号：US16670203

申请日：2019-10-31

Applicant: SII Printek Inc.

Inventor： Suguru Munakata ,  Yuji Nakamura ,  Yuzuru Kubota ,  Daiki Irokawa

IPC: B41J2/16 ,  B23K26/362

Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.