METHOD OF MANUFACTURING HEAD CHIP AND HEAD CHIP OF LIQUID JET HEAD

    公开(公告)号:US20210187950A1

    公开(公告)日:2021-06-24

    申请号:US17123393

    申请日:2020-12-16

    Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

    Method of manufacturing head chip and method of manufacturing liquid jet head

    公开(公告)号:US11548283B2

    公开(公告)日:2023-01-10

    申请号:US16670203

    申请日:2019-10-31

    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

    Head chip, liquid jet head, liquid jet recording device, and method of manufacturing head chip

    公开(公告)号:US12070948B2

    公开(公告)日:2024-08-27

    申请号:US17965579

    申请日:2022-10-13

    CPC classification number: B41J2/1433

    Abstract: A head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring the tolerance of the displacement between nozzle holes and communication holes while ensuring the bonding area between an actuator plate and an intermediate plate are provided. The head chip according to an aspect of the present disclosure includes an actuator plate, a nozzle plate disposed so as to be opposed to the actuator plate, and an intermediate plate disposed between the actuator plate and the nozzle plate. The communication holes each include a groove part having a lower-side opening part opening toward the nozzle hole, and a penetrating part having an upper-side opening part opening toward an ejection channel. A dimension in the X direction in the upper-side opening part is larger than a dimension in the X direction in the upper-side opening part, and a dimension in the X direction in the upper-side opening part is no larger than a dimension in the X direction of the channel opening part opening on a channel opening surface of the ejection channel.

    METHOD OF MANUFACTURING HEAD CHIP AND METHOD OF MANUFACTURING LIQUID JET HEAD

    公开(公告)号:US20200147969A1

    公开(公告)日:2020-05-14

    申请号:US16670203

    申请日:2019-10-31

    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

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