Invention Grant
- Patent Title: Substrate processing chamber
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Application No.: US16876845Application Date: 2020-05-18
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Publication No.: US11560626B2Publication Date: 2023-01-24
- Inventor: Timothy Joseph Franklin , Adam Fischbach , Edward Haywood , Abhijit B. Mallick , Pramit Manna , Carlaton Wong , Stephen C. Garner , Eswaranand Venkatasubramanian
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/458
- IPC: C23C16/458 ; H01J37/32 ; C23C16/46 ; C23C16/50 ; C23C16/455 ; H01L21/02 ; H01L21/033

Abstract:
Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.
Public/Granted literature
- US20200370177A1 SUBSTRATE PROCESSING CHAMBER Public/Granted day:2020-11-26
Information query
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