Invention Grant
- Patent Title: Pattern inspection apparatus and pattern outline position acquisition method
-
Application No.: US17320435Application Date: 2021-05-14
-
Publication No.: US11569057B2Publication Date: 2023-01-31
- Inventor: Shinji Sugihara
- Applicant: NuFlare Technology, Inc.
- Applicant Address: JP Yokohama
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Yokohama
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-119714 20200713
- Main IPC: H01J37/22
- IPC: H01J37/22 ; H01J37/244 ; H01J37/10 ; H01J37/09 ; G06T7/00 ; G06T7/73 ; H01J37/28

Abstract:
According to one aspect of the present invention, a pattern inspection apparatus includes a circuit configured to perform, for each direction, filter processing on the image, using a plurality of two-dimensional spatial filter functions with different orientations; a circuit configured to extract a plurality of pixels each having a predetermined value larger than a first threshold, in pixel values each for the each direction of after the filter processing, as a plurality of outline pixel candidates through which an outline of the figure pattern passes; and a circuit configured to extract a plurality of outline pixels from the plurality of outline pixel candidates by excluding outline pixel candidates each of which has a differential value, greater than or equal to a second threshold, obtained by differentiating a pixel value of before the filter processing in a second direction orthogonal to a first direction corresponding to the predetermined value.
Public/Granted literature
- US20220013327A1 PATTERN INSPECTION APPARATUS AND PATTERN OUTLINE POSITION ACQUISITION METHOD Public/Granted day:2022-01-13
Information query