A process for conformally coating passive surface mount components soldered to a printed circuit substrate of a lidless flip-chip ball grid array package includes affixing a stiffener ring to the substrate before forming a conformal coating on the passive surface mount components. The stiffener ring is affixed to the substrate so that the plurality of passive surface mount components and the integrated circuit die are contained within an opening formed by the stiffener ring. After affixing the stiffener ring to the substrate, the conformal coating is formed on the passive surface mount components. The conformal coating extends over each of the passive surface mount components, around a periphery of each of the passive surface mount components, and under each of the passive surface mount components. A product made according to the process is also disclosed.