Invention Grant
- Patent Title: Projector, 3D sensing module and method for fabricating the projector
-
Application No.: US16559564Application Date: 2019-09-03
-
Publication No.: US11573485B2Publication Date: 2023-02-07
- Inventor: Yin-Dong Lu , Chih-Yu Chuang , Shi-Jen Wu
- Applicant: HIMAX TECHNOLOGIES LIMITED
- Applicant Address: TW Tainan
- Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee: HIMAX TECHNOLOGIES LIMITED
- Current Assignee Address: TW Tainan
- Agency: CKC & Partners Co., LLC
- Main IPC: G03B21/20
- IPC: G03B21/20 ; G03B21/14 ; G05B11/32

Abstract:
A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.
Public/Granted literature
- US20210063859A1 PROJECTOR, 3D SENSING MODULE AND METHOD FOR FABRICATING THE PROJECTOR Public/Granted day:2021-03-04
Information query