Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17338696Application Date: 2021-06-04
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Publication No.: US11600531B2Publication Date: 2023-03-07
- Inventor: Chih-Kai Hsu , Ssu-I Fu , Chun-Ya Chiu , Chi-Ting Wu , Chin-Hung Chen , Yu-Hsiang Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/06

Abstract:
A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, and a metal gate adjacent to the isolation structure. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
Public/Granted literature
- US20210296183A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-09-23
Information query
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