Invention Grant
- Patent Title: Landing pad structure
-
Application No.: US17225113Application Date: 2021-04-08
-
Publication No.: US11610897B2Publication Date: 2023-03-21
- Inventor: Keng-Ping Lin , Tetsuharu Kurokawa , Tzu-Ming Ou Yang , Shu-Ming Li
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW108100253 20190103
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/06 ; H01L21/761 ; H01L21/033 ; H01L21/027 ; H01L21/02 ; H01L21/768 ; H01L21/311
Abstract:
Provided is a landing pad structure including a substrate, a plurality of landing pads, a guard ring, and an edge pattern. The substrate includes a cell region, a periphery region, and a guard ring region located between the cell region and the periphery region. The landing pads are arranged on the substrate in the cell region in a hexagonal close packing (HCP) configuration. The guard ring is disposed on the substrate in the guard ring region in a strip form. The edge pattern is disposed on the substrate in the cell region and close to the guard ring region. A method of manufacturing the landing pad structure is also provided.
Public/Granted literature
- US20210225850A1 LANDING PAD STRUCTURE Public/Granted day:2021-07-22
Information query
IPC分类:
