Invention Grant
- Patent Title: Electronic device, electronic module and methods for fabricating the same
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Application No.: US16926162Application Date: 2020-07-10
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Publication No.: US11615963B2Publication Date: 2023-03-28
- Inventor: Paul Frank , Gretchen Adema , Thomas Bertaud , Michael Ehmann , Eric Graetz , Kamil Karlovsky , Evelyn Napetschnig , Werner Robl , Tobias Schmidt , Joachim Seifert , Frank Wagner , Stefan Woehlert
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102016117826.8 20160921
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/285 ; H01L29/861
Abstract:
An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.
Public/Granted literature
- US20200343094A1 ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING THE SAME Public/Granted day:2020-10-29
Information query
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