Invention Grant
- Patent Title: Ion milling device and ion milling method
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Application No.: US16077782Application Date: 2016-02-26
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Publication No.: US11621141B2Publication Date: 2023-04-04
- Inventor: Toru Iwaya , Hisayuki Takasu , Sakae Koubori
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- International Application: PCT/JP2016/055868 WO 20160226
- International Announcement: WO2017/145371 WO 20170831
- Main IPC: H01J37/20
- IPC: H01J37/20 ; H01J37/305 ; H01J37/08 ; H01J37/26 ; H01J37/304 ; H01J37/30

Abstract:
Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.
Public/Granted literature
- US20210193430A1 Ion Milling Device and Ion Milling Method Public/Granted day:2021-06-24
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