Invention Grant
- Patent Title: Liquid-cooling radiator module
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Application No.: US17125510Application Date: 2020-12-17
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Publication No.: US11626346B2Publication Date: 2023-04-11
- Inventor: Chien-Yu Chen , Tian-Li Ye , Yu Chen , Chien-An Chen
- Applicant: Auras Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Auras Technology Co., Ltd.
- Current Assignee: Auras Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109143308 20201208
- Main IPC: H01L23/473
- IPC: H01L23/473 ; F28D1/053 ; H05K7/20

Abstract:
A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.
Public/Granted literature
- US20210305129A1 LIQUID-COOLING RADIATOR MODULE Public/Granted day:2021-09-30
Information query
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