Liquid cooling module and its liquid cooling head

    公开(公告)号:US11832418B2

    公开(公告)日:2023-11-28

    申请号:US17213605

    申请日:2021-03-26

    CPC classification number: H05K7/20272 H05K7/20254 H05K7/20263 H05K7/20281

    Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.

    COLD PLATE
    5.
    发明申请

    公开(公告)号:US20210127526A1

    公开(公告)日:2021-04-29

    申请号:US17026469

    申请日:2020-09-21

    Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

    Heat dissipation system and coolant distribution module thereof

    公开(公告)号:US10785892B1

    公开(公告)日:2020-09-22

    申请号:US16516309

    申请日:2019-07-19

    Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

    Cooling liquid distribution device

    公开(公告)号:US10152096B1

    公开(公告)日:2018-12-11

    申请号:US15871177

    申请日:2018-01-15

    Abstract: A cooling liquid distribution device includes a storage tank, a liquid level detector and a liquid level displaying structure. The storage tank includes a first chamber for storing a cooling liquid. When a liquid level of the cooling liquid in the first chamber is detected by the liquid level detector, a liquid level detection result is generated. The liquid level displaying structure includes a second chamber, which is in fluid communication with the first chamber. Consequently, a liquid level of the cooling liquid in the second chamber is equal to the liquid level of the cooling liquid in the first chamber. The liquid level displaying structure is optically transmissible, and thus the liquid level of the cooling liquid in the second chamber is visible through the liquid level displaying structure. The storage amount of the cooling liquid can be realized by the user more easily.

    Liquid-cooling heat dissipation device

    公开(公告)号:US11523537B2

    公开(公告)日:2022-12-06

    申请号:US17114814

    申请日:2020-12-08

    Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

    Water-cooling head
    9.
    发明授权

    公开(公告)号:US10674629B1

    公开(公告)日:2020-06-02

    申请号:US16394010

    申请日:2019-04-25

    Abstract: A water-cooling head includes a casing, an inclined flow-guiding structure and a bottom plate assembly. The casing includes an inlet and an outlet. A liquid is fed into the inlet. The inclined flow-guiding structure is disposed within the casing, and includes plural first openings. A bottom end of the inclined flow-guiding structure is located under the inlet. A top end of the inclined flow-guiding structure is arranged beside the outlet. The top end is located at a level higher than the bottom end. A second opening is formed in the bottom end. The bottom plate assembly is assembled with the casing, and located under the inclined flow-guiding structure. The bottom plate assembly includes a fin group. After the liquid is transferred to the fin group through the second opening or the plural first openings, the liquid is exited from the outlet.

    Cold plate
    10.
    发明授权

    公开(公告)号:US11800678B2

    公开(公告)日:2023-10-24

    申请号:US17026469

    申请日:2020-09-21

    CPC classification number: H05K7/20254 H05K7/20272

    Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

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