Invention Grant
- Patent Title: High electron mobility transistor and method for fabricating the same
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Application No.: US16731058Application Date: 2019-12-31
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Publication No.: US11749740B2Publication Date: 2023-09-05
- Inventor: Bo-Rong Chen , Che-Hung Huang , Chun-Ming Chang , Yi-Shan Hsu , Chih-Tung Yeh , Shin-Chuan Huang , Wen-Jung Liao , Chun-Liang Hou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 1911241221.7 2019.12.06
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/20

Abstract:
A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a first barrier layer on a substrate; forming a p-type semiconductor layer on the first barrier layer; forming a hard mask on the p-type semiconductor layer; patterning the hard mask and the p-type semiconductor layer; and forming a spacer adjacent to the hard mask and the p-type semiconductor layer.
Public/Granted literature
- US20210175343A1 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-06-10
Information query
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