- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16895989Application Date: 2020-06-08
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Publication No.: US11756904B2Publication Date: 2023-09-12
- Inventor: Yuanhao Yu , Cheng-Lin Ho , Yu-Lin Shih , Shih-Chun Li
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01Q1/22
Abstract:
A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.
Public/Granted literature
- US20210384148A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-12-09
Information query
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