Invention Grant
- Patent Title: Power supply signal conditioning for an electrostatic chuck
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Application No.: US17036048Application Date: 2020-09-29
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Publication No.: US11776835B2Publication Date: 2023-10-03
- Inventor: Zheng John Ye , Daemian Raj Benjamin Raj , Rana Howlader , Abhigyan Keshri , Sanjay G. Kamath , Dmitry A. Dzilno , Juan Carlos Rocha-Alvarez , Shailendra Srivastava , Kristopher R. Enslow , Xinhai Han , Deenesh Padhi , Edward P. Hammond
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01J37/32

Abstract:
Exemplary semiconductor processing systems may include a processing chamber and an electrostatic chuck disposed at least partially within the processing chamber. The electrostatic chuck may include at least one electrode and a heater. A semiconductor processing system may include a power supply to provide a signal to the electrode to provide electrostatic force to secure a substrate to the electrostatic chuck. The system may also include a filter communicatively coupled between the power supply and the electrode. The filter is configured to remove or reduce noise introduced into the chucking signal by operating the heater while the electrostatic force on the substrate is maintained. The filter may include active circuitry, passive circuitry, or both, and may include an adjustment circuit to set the gain of the filter so that an output signal level from the filter corresponds to an input signal level for the filter.
Public/Granted literature
- US20220102179A1 POWER SUPPLY SIGNAL CONDITIONING FOR AN ELECTROSTATIC CHUCK Public/Granted day:2022-03-31
Information query
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